UPD70F3735GC-GAD-AX Renesas Electronics America, UPD70F3735GC-GAD-AX Datasheet - Page 756

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UPD70F3735GC-GAD-AX

Manufacturer Part Number
UPD70F3735GC-GAD-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3735GC-GAD-AX

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
66
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3735GC-GAD-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
V850ES/JF3-L
29.1.5 Operation
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
The on-chip debug function is made invalid under the conditions shown in the table below.
When this function is not used, keep the DRST pin low until the OCDM.OCDM0 flag is cleared to 0.
P05/INTP2/DRST
OCDM0
RESET
Releasing reset
Remark L: Low-level input
DRST Pin
L
H
Figure 29-2. Timing When On-Chip Debug Function Is Not Used
H: High-level input
OCDM0 Flag
Low-level input
Invalid
Invalid
0
CHAPTER 29 ON-CHIP DEBUG FUNCTION
Clearing OCDM0 bit
high level can be input/output.
After OCDM0 bit is cleared,
Invalid
Valid
1
Page 740 of 816

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