XC3S1000-4FG456I Xilinx Inc, XC3S1000-4FG456I Datasheet - Page 122

• Manufacturer Part Number: XC3S1000-4FG456I
• Description: FIELD PROGRAMMABLE GATE ARRAY
• Manufacturer: Xilinx Inc
• Series: Spartan™-3r

Specifications of XC3S1000-4FG456I

• Number Of Logic Elements/cells: 17280
• Number Of Labs/clbs: 1920
• Total Ram Bits: 442368
• Number Of I /o: 333
• Number Of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 456-BBGA
• Package: 456FBGA
• Family Name: Spartan®-3
• Device Logic Units: 17280
• Device System Gates: 1000000
• Maximum Internal Frequency: 630 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 333
• Ram Bits: 442368
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Spartan-3 FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3 FPGA is reported using either
the
grated in the Xilinx ISE development software.
vides the thermal characteristics for the various Spartan-3
package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
122
XPower
Estimator (XPE) or the XPower Analyzer inte-
JC
) indicates the
Table 85
www.xilinx.com
pro-
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
JA
value in a system without a fan. The thermal
DS099-4 (v2.5) December 4, 2009
Product Specification
JA
JB
) value
) value
JA
R