XC3S1000-4FG456I Xilinx Inc, XC3S1000-4FG456I Datasheet - Page 177

• Manufacturer Part Number: XC3S1000-4FG456I
• Description: FIELD PROGRAMMABLE GATE ARRAY
• Manufacturer: Xilinx Inc
• Series: Spartan™-3r

Specifications of XC3S1000-4FG456I

• Number Of Logic Elements/cells: 17280
• Number Of Labs/clbs: 1920
• Total Ram Bits: 442368
• Number Of I /o: 333
• Number Of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 456-BBGA
• Package: 456FBGA
• Family Name: Spartan®-3
• Device Logic Units: 17280
• Device System Gates: 1000000
• Maximum Internal Frequency: 630 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 333
• Ram Bits: 442368
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 102: FG676 Package Pinout (Continued)
User I/Os by Bank
Table 103
tributed between the eight I/O banks for the XC3S1000 in
the FG676 package. Similarly,
Table 103: User I/Os Per Bank for XC3S1000 in FG676 Package
DS099-4 (v2.5) December 4, 2009
Product Specification
Notes:
1.
2.
3.
Bank
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
AUX
AUX
AUX
AUX
AUX
AUX
AUX
AUX
XC3S1500 balls D25 and F25 are not VREF pins although they are designated as such. If a design uses an IOSTANDARD requiring VREF in bank
2 then apply the workaround in
XC3S4000 is pin compatible with XC3S2000 but uses alternate differential pair labeling on six package balls (H20, H21, H22, H23, H24, J21).
XC3S5000 is pin compatible with XC3S4000 but uses alternate differential pair functionality on fifteen package balls (A3, A8, B8, B18, C4, C8, C18,
D8, D18, E8, E18, H23, H24, AB9, and AC9).
Bottom
Edge
Right
Left
M0
M1
M2
PROG_B
TCK
TDI
TDO
TMS
Top
indicates how the available user-I/O pins are dis-
XC3S1000
Pin Name
R
Bank
I/O
0
1
2
3
4
5
6
7
M0
M1
M2
PROG_B
TCK
TDI
TDO
TMS
Answer Record 20519
XC3S1500
Pin Name
Table 104
Maximum
I/O
49
50
48
48
50
50
48
48
shows how the
M0
M1
M2
PROG_B
TCK
TDI
TDO
TMS
XC3S2000
Pin Name
.
I/O
40
41
41
41
35
35
41
41
www.xilinx.com
available user-I/O pins are distributed between the eight I/O
banks for the XC3S1500 in the FG676 package. Finally,
Table 105
XC3S4000, and XC3S5000 in the FG676 package.
M0
M1
M2
PROG_B
TCK
TDI
TDO
TMS
DUAL
0
0
0
0
6
6
0
0
XC3S4000
Pin Name
All Possible I/O Pins by Type
shows the same information for the XC3S2000,
Spartan-3 FPGA Family: Pinout Descriptions
DCI
2
2
2
2
2
2
2
2
M0
M1
M2
PROG_B
TCK
TDI
TDO
TMS
XC3S5000
Pin Name
VREF
5
5
5
5
5
5
5
5
Pin Number
FG676
AE3
AC3
AF3
D24
B24
A24
D3
C1
GCLK
2
2
0
0
2
2
0
0
CONFIG
CONFIG
CONFIG
CONFIG
JTAG
JTAG
JTAG
JTAG
Type
177