XC3S1000-4FG456I Xilinx Inc, XC3S1000-4FG456I Datasheet - Page 8

• Manufacturer Part Number: XC3S1000-4FG456I
• Description: FIELD PROGRAMMABLE GATE ARRAY
• Manufacturer: Xilinx Inc
• Series: Spartan™-3r

Specifications of XC3S1000-4FG456I

• Number Of Logic Elements/cells: 17280
• Number Of Labs/clbs: 1920
• Total Ram Bits: 442368
• Number Of I /o: 333
• Number Of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 456-BBGA
• Package: 456FBGA
• Family Name: Spartan®-3
• Device Logic Units: 17280
• Device System Gates: 1000000
• Maximum Internal Frequency: 630 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 333
• Ram Bits: 442368
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Spartan-3 FPGA Family: Introduction and Ordering Information
Ordering Information
Spartan-3 FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. The
Pb-free packages include a special ‘G’ character in the ordering code.
Standard Packaging
Pb-Free Packaging
For additional information on Pb-free packaging, see
Packages".
Notes:
1. The -5 speed grade is exclusively available in the Commercial temperature range.
2. The CP132, CPG132, FG1156, and FGG1156 packages are being discontinued and are not recommended for new designs.
See
8
10
XC3S50
XC3S200
XC3S400
XC3S1000
XC3S1500
XC3S2000
XC3S4000
XC3S5000
Device
http://www.xilinx.com/support/documentation/spartan-3_customer_notices.htm
-4 Standard Performance
-5 High Performance
Speed Grade
Package Type
Package Type
Speed Grade
Speed Grade
Device Type
Device Type
Example:
Example:
(1)
XC3S50 -4 PQ 208 C
XC3S50 -4 PQ G 208 C
FG(G)1156
CP(G)132
VQ(G)100
PQ(G)208
TQ(G)144
FG(G)320
FG(G)456
FG(G)676
FG(G)900
FT(G)256
(2)
(2)
100-pin Very Thin Quad Flat Pack (VQFP)
132-pin Chip-Scale Package (CSP)
144-pin Thin Quad Flat Pack (TQFP)
208-pin Plastic Quad Flat Pack (PQFP)
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
320-ball Fine-Pitch Ball Grid Array (FBGA)
456-ball Fine-Pitch Ball Grid Array (FBGA)
676-ball Fine-Pitch Ball Grid Array (FBGA)
900-ball Fine-Pitch Ball Grid Array (FBGA)
1156-ball Fine-Pitch Ball Grid Array (FBGA)
Package Type / Number of Pins
XAPP427
www.xilinx.com
: "Implementation and Solder Reflow Guidelines for Pb-Free
Temperature Range:
Number of Pins
Temperature Range:
Number of Pins
Pb-free
C = Commercial (T
I = Industrial (T
C = Commercial (T
I = Industrial (T
J
J
= -40
for the latest updates.
= -40
J
J
= 0
= 0
˚
˚
C to 100
C to 100
˚
˚
DS099-1_02b_071304
DS099-1_02a_071304
C to 85
C to 85
DS099-1 (v2.5) December 4, 2009
˚
˚
C Commercial (0°C to 85°C)
˚
C)
˚
C)
I Industrial (–40°C to 100°C)
C)
C)
Temperature Range (T
Product Specification
J
)
R