ADSP-BF504BCPZ-3F Analog Devices Inc, ADSP-BF504BCPZ-3F Datasheet - Page 20

• Manufacturer Part Number: ADSP-BF504BCPZ-3F
• Description: Blackfin W/Processor & Executable Flash
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF504BCPZ-3F

• Interface: CAN, EBI/EMI, I²C, IrDA, PPI, SPI, SPORT, UART/USART
• Clock Rate: 300MHz
• Non-volatile Memory: FLASH (16MB)
• On-chip Ram: 68kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.29V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: *
• Package / Case: *
• Rohs Compliant: YES
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-BF504/ADSP-BF504F/ADSP-BF506F
Additional highlights of the internal ADC include:
ADC APPLICATION HINTS
The following sections provide application hints for using the
ADC.
Grounding and Layout Considerations
The analog and digital supplies to the ADC are independent and
separately pinned out to minimize coupling between the analog
and digital sections of the device. The printed circuit board
(PCB) that houses the ADC should be designed so that the ana-
log and digital sections are separated and confined to certain
areas of the board. This design facilitates the use of ground
planes that can be easily separated.
To provide optimum shielding for ground planes, a minimum
etch technique is generally best. All AGND pins should be sunk
in the AGND plane. Digital and analog ground planes should be
joined in only one place. If the ADC is in a system where multi-
ple devices require an AGND to DGND connection, the
connection should still be made at one point only, a star ground
point that should be established as close as possible to the
ground pins on the ADC.
Avoid running digital lines under the device as this couples
noise onto the die. Avoid running digital lines in the area of the
AGND pad as this couples noise onto the ADC die and into the
AGND plane. The power supply lines to the ADC should use as
large a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line.
To avoid radiating noise to other sections of the board, fast
switching signals, such as clocks, should be shielded with digital
ground, and clock signals should never run near the analog
inputs. Avoid crossover of digital and analog signals. To reduce
the effects of feed through within the board, traces on opposite
sides of the board should run at right angles to each other.
Good decoupling is also important. All analog supplies should
be decoupled with 10 μF tantalum capacitors in parallel with
0.1 μF capacitors to GND. To achieve the best results from these
decoupling components, they must be placed as close as possible
to the device, ideally right up against the device. The 0.1 μF
capacitors should have low effective series resistance (ESR) and
effective series inductance (ESI), such as the common ceramic
• Two complete ADC functions allow simultaneous sam-
• High throughput with low power consumption
• The internal ADC offers both a standard 0 V to V
• No pipeline delay—The part features two standard succes-
pling and conversion of two channels—Each ADC has
three fully/pseudo differential pairs, or six single-ended
channels, as programmed. The conversion result of both
channels is simultaneously available on separate data lines,
or in succession on one data line if only one serial connec-
tion is available.
range and a 2 × V
sive approximation ADCs with accurate control of the
sampling instant via a CS input and once off conversion
control.
REF
input range.
Rev. 0 | Page 20 of 80 | December 2010
REF
input
types or surface-mount types. These low ESR and ESI capacitors
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching.
RELATED DOCUMENTS
The following publications that describe the ADSP-BF50x pro-
cessors (and related processors) can be ordered from any
Analog Devices sales office or accessed electronically on our
website:
RELATED SIGNAL CHAINS
A signal chain is a series of signal-conditioning electronic com-
ponents that receive input (data acquired from sampling either
real-time phenomena or from stored data) in tandem, with the
output of one portion of the chain supplying input to the next.
Signal chains are often used in signal processing applications to
gather and process data or to apply system controls based on
analysis of real-time phenomena. For more information about
this term and related topics, see the "signal chain" entry in
Wikipedia
website.
Analog Devices eases signal processing system development by
providing signal processing components that are designed to
work together well. A tool for viewing relationships between
specific applications and related components is available on the
www.analog.com
The Application Signal Chains page in the Circuits from the
Lab
• Getting Started With Blackfin Processors
• ADSP-BF50x Blackfin Processor Hardware Reference (vol-
• Blackfin Processor Programming Reference
• ADSP-BF50x Blackfin Processor Anomaly List
• Graphical circuit block diagram presentation of signal
• Drill down links for components in each chain to selection
• Reference designs applying best practice design techniques
TM
umes 1 and 2)
chains for a variety of circuit types and applications
guides and application information
site (http:\\www.analog.com\signalchains) provides:
or the
Glossary of EE Terms
website.
on the Analog Devices