MT48LC2M32B2TG-6:G Micron Technology Inc, MT48LC2M32B2TG-6:G Datasheet - Page 29

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MT48LC2M32B2TG-6:G

Manufacturer Part Number
MT48LC2M32B2TG-6:G
Description
DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC2M32B2TG-6:G

Density
64 Mb
Maximum Clock Rate
166 MHz
Package
86TSOP-II
Address Bus Width
13 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|7.5|5.5 ns
Operating Temperature
0 to 70 °C
Organization
2Mx32
Address Bus
13b
Access Time (max)
17/7.5/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC2M32B2TG-6:G
Quantity:
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Part Number:
MT48LC2M32B2TG-6:G
Manufacturer:
MT
Quantity:
20 000
WRITEs
Figure 16:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
WRITE Command
WRITE bursts are initiated with a WRITE command, as shown in Figure 16.
The starting column and bank addresses are provided with the WRITE command, and
auto precharge is either enabled or disabled for that access. If auto precharge is enabled,
the row being accessed is precharged at the completion of the burst. For the generic
WRITE commands used in the following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be registered coincident with
the WRITE command. Subsequent data elements will be registered on each successive
positive clock edge. Upon completion of a fixed-length burst, assuming no other
commands have been initiated, the DQs will remain High-Z and any additional input
data will be ignored (see Figure 17 on page 30). A full-page burst will continue until
terminated (at the end of the page, it will wrap to column 0 and continue).
Data for any WRITE burst may be truncated with a subsequent WRITE command, and
data for a fixed-length WRITE burst may be immediately followed by data for a WRITE
command. The new WRITE command can be issued on any clock following the previous
WRITE command, and the data provided coincident with the new command applies to
the new command. An example is shown in Figure 18 on page 30. Data n + 1 is either the
last of a burst of two or the last desired of a longer burst. This 64Mb SDRAM uses a pipe-
lined architecture and therefore does not require the 2n rule associated with a prefetch
architecture. A WRITE command can be initiated on any clock cycle following a previous
WRITE command. Full-speed random write accesses within a page can be performed to
the same bank, as shown in Figure 19 on page 31, or each subsequent WRITE may be
performed to a different bank.
A8, A9
A0–A7
BA0, 1
RAS#
CAS#
WE#
CKE
A10
CLK
CS#
HIGH
VALID ADDRESS
DISABLE AUTO PRECHARGE
ENABLE AUTO PRECHARGE
COLUMN
ADDRESS
ADDRESS
BANK
DON’T CARE
29
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
Commands

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