MT48LC2M32B2TG-6:G Micron Technology Inc, MT48LC2M32B2TG-6:G Datasheet - Page 68

• Manufacturer Part Number: MT48LC2M32B2TG-6:G
• Description: DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC2M32B2TG-6:G

• Density: 64 Mb
• Maximum Clock Rate: 166 MHz
• Package: 86TSOP-II
• Address Bus Width: 13 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 17|7.5|5.5 ns
• Operating Temperature: 0 to 70 °C
• Organization: 2Mx32
• Address Bus: 13b
• Access Time (max): 17/7.5/5.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 180mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Package Dimensions
Figure 50:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
PIN #1 ID
PLATED LEAD FINISH:
TG (90% Sn, 10% Pb) OR P (100% Sn) 0.01 ±0.005 THICK PER SIDE
PACKAGE WIDTH AND LENGTH DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.25 PER SIDE.
PLASTIC PACKAGE MATERIAL: EPOXY NOVOLAC
86-Pin Plastic TSOP II (400 mil)
0.50
TYP
Notes:
22.22 ±0.08
2X R 0.75
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. “2X” means the notch is present in two locations (both ends of the device).
2X R 1.00
0.025mm per side.
0.20
+0.07
-0.03
1.20 MAX
2X 2.80
0.61
2X 0.10
10.16 ±0.08
0.10
68
11.76 ±0.20
0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
+0.03
-0.02
0.10
SEE DETAIL A
+0.10
-0.05
0.50 ±0.10
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
DETAIL A
0.25
GAGE
PLANE
0.80
TYP