MT48LC2M32B2TG-6:G Micron Technology Inc, MT48LC2M32B2TG-6:G Datasheet - Page 50

• Manufacturer Part Number: MT48LC2M32B2TG-6:G
• Description: DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC2M32B2TG-6:G

• Density: 64 Mb
• Maximum Clock Rate: 166 MHz
• Package: 86TSOP-II
• Address Bus Width: 13 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 17|7.5|5.5 ns
• Operating Temperature: 0 to 70 °C
• Organization: 2Mx32
• Address Bus: 13b
• Access Time (max): 17/7.5/5.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 180mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
23. The clock frequency must remain constant during access or precharge states (READ,
24. Auto precharge mode only.
25. JEDEC and PC100 specify three clocks.
26.
27. V
28. Check factory for availability of specially screened devices having
WRITE, including
data rate.
t
t
CK = 7ns for -7, 6ns for -6, 5.5ns for -55, and 5ns for -5.
CK for 100 MHz and slower (
DD
(MIN) = 3.135V for -6, -55, and -5 speed grades.
t
WR, and PRECHARGE commands). CKE may be used to reduce the
50
t
CK = 10ns and higher) in manual precharge.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
t
WR = 10ns.
t
Notes
WR = 1