UJA1065 NXP Semiconductors, UJA1065 Datasheet - Page 76

• Manufacturer Part Number: UJA1065
• Manufacturer: NXP Semiconductors

Specifications of UJA1065

• Lead Free Status / RoHS Status: Supplier Unconfirmed

NXP Semiconductors
12
13
13.1
13.2
13.3
13.4
14
15
15.1
15.2
15.3
15.4
16
17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 68
Soldering of SMD packages . . . . . . . . . . . . . . 69
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 72
Legal information. . . . . . . . . . . . . . . . . . . . . . . 73
Contact information. . . . . . . . . . . . . . . . . . . . . 74
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Wave and reflow soldering . . . . . . . . . . . . . . . 69
Introduction to soldering . . . . . . . . . . . . . . . . . 69
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 69
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 70
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
High-speed CAN/LIN fail-safe system basis chip
Date of release: 25 February 2010
Document identifier: UJA1065_7
UJA1065
All rights reserved.