PEF22558EV11GXP Lantiq, PEF22558EV11GXP Datasheet - Page 83

• Manufacturer Part Number: PEF22558EV11GXP
• Manufacturer: Lantiq

Specifications of PEF22558EV11GXP

• Screening Level: Industrial
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Lead Free Status / RoHS Status: Compliant

Table 30
Pin
A(10)
A(5:0)
D(15:5)
17
Due to the increased number of signals, a PG-LBGA-256-1 package is used. It uses a
16
17 mm
package materials only (halogen-free, lead-free solder balls, etc.). Solder balls with lead
are available on request.
Delta Sheet
16 full matrix (256 balls at 1 mm ball pitch), with an overall package size of
17 mm. See
Package
Pinstrapping Overview (cont’d)
Used
only in micro
controller
interface
modes
only in SCI
interface
mode
only in SCI or
SPI interface
mode
Figure 34
Pinstrapping Function
Used as second chip select signal in compatibility
mode, see
Defines the 6 MSBs of the SCI source address, if SCI
interface mode is selected by IM(1:0), see
A5 is MSB
Programs PLL if SPI- or SCI-Interface is used instead
of registers GCM5 and GCM6, see
If SPI- or SCI-Interface is selected
- D(15:11) values programs PLL dividing factor M,
- D(10:5) values programs PLL dividing factor N
equivalent to programming by register bits
GCM5.PLL_M(4:0) or GCM6.PLL_N(5:0) as it is if
microcontroller mode (Intel or Motorola) is selected
for mechanical details. The package uses “green”
83
Table 1
Chapter
Rev. 2.0, 2005-05-03
OctalFALC
PEF 22558 E
Chapter 4.1
4.
Package
TM