PNX1311EH NXP Semiconductors, PNX1311EH Datasheet - Page 196

PNX1311EH

Manufacturer Part Number
PNX1311EH
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PNX1311EH

Lead Free Status / RoHS Status
Not Compliant

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PNX1311EH
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PNX1300/01/02/11 Data Book
Figure 12-10
MM_CONFIG.SIZE must be set to 7 (i.e. 32 MB rank
size,
12-14
Figure 12-10. Schematic of a 32-MB memory system consisting of two 4×2M×16 SDRAM chips (one rank)
Section
is not backward compatible with TM-1300.
12.6.1). This new scheme has the advan-
PRELIMINARY SPECIFICATION
MM_CLK[0]
MM_CLK[1]
CLK
Control
CLK
Control
Address[11:0]
Address[11:0]
BA[1:0]
BA[1:0]
PNX1300
4×2M×16
4×2M×16
SDRAM
SDRAM
tage of being compatible with the
lows to build a system that receives 32- or 64-MB mem-
ory system with the exact same footprint.
DQM[1:0]
DQM[1:0]
DQ[15:0]
DQ[15:0]
CS#
CS#
GND
GND
MM_DQ[31:16]
MM_DQM[3:2]
MM_DQM[1:0]
MM_DQ[15:0]
Philips Semiconductors
Figure
12-12. This al-

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