FDMS3606AS Fairchild Semiconductor, FDMS3606AS Datasheet - Page 10
FDMS3606AS
Manufacturer Part Number
FDMS3606AS
Description
MOSFET Power 30V Asymtrc Dual NCh PowerTrench MOSFET
Manufacturer
Fairchild Semiconductor
Datasheet
1.FDMS3606AS.pdf
(15 pages)
Specifications of FDMS3606AS
Configuration
Dual
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
11 mOhms, 2.8 mOhms
Forward Transconductance Gfs (max / Min)
61 S, 154 S
Drain-source Breakdown Voltage
30 V
Continuous Drain Current
13 A, 27 A
Power Dissipation
2.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
Power 56
Gate Charge Qg
59 nC, 27 nC
Minimum Operating Temperature
- 55
Module Configuration
Dual
Continuous Drain Current Id
40A
Drain Source Voltage Vds
30V
On Resistance Rds(on)
0.0058ohm
Lead Free Status / Rohs Status
Details
©2011 Fairchild Semiconductor Corporation
FDMS3606AS Rev.C4
Typical Characteristics
SyncFET Schottky body diode
Characteristics
Fairchild’s SyncFET process embeds a Schottky diode in parallel
with PowerTrench MOSFET. This diode exhibits similar
characteristics to a discrete external Schottky diode in parallel
with a MOSFET. Figure 27 shows the reverse recovery
characteristic of the FDMS3606AS.
diode reverse recovery characteristic
30
25
20
15
10
-5
Figure 27. FDMS3606AS SyncFET body
5
0
0
50
100
TIME (ns)
150
didt = 300 A/
(continued)
200
μ
s
250
300
10
Schottky barrier diodes exhibit significant leakage at high tem-
perature and high reverse voltage. This will increase the power
in the device.
10
10
10
10
10
Figure 28. SyncFET body diode reverse
leakage versus drain-source voltage
-2
-3
-4
-5
-6
0
5
V
DS
10
, REVERSE VOLTAGE (V)
T
T
J
J
T
15
= 100
= 125
J
= 25
o
o
o
C
C
C
20
www.fairchildsemi.com
25
30