IBM25PPC750FL-GR0133T IBM MICROELECTRONICS, IBM25PPC750FL-GR0133T Datasheet - Page 29

• Manufacturer Part Number: IBM25PPC750FL-GR0133T
• Description: MPU 750xx RISC 32-Bit 0.13um 600MHz 1.8V/2.5V/3.3V 750-Pin CBGA Tray
• Manufacturer: IBM MICROELECTRONICS

Specifications of IBM25PPC750FL-GR0133T

• Package: 750CBGA
• Device Core: PowerPC
• Family Name: 750xx
• Number Of Cpu Cores: 1
• Data Bus Width: 32 Bit
• Maximum Speed: 600 MHz
• I/o Voltage: 1.8|2.5|3.3 V
• Operating Temperature: -40 to 105 °C

Preliminary
4. Dimensions and Signal Assignments
IBM offers a CBGA that supports 292 balls for the 750FL microprocessor package.
4.1 Module Substrate Decoupling Voltage Assignments
The on-board substrate voltage-to-ground assignments for the capacitor locations are shown in Figure 4-1.
Figure 4-1. Module Substrate Decoupling Voltage Assignments
4.2 Package
The module mass is approximately 2.44 grams; the ball pitch is 1 mm; the ball diameter target is approxi-
mately 0.635 mm; and the JEDEC moisture sensitivity level (MSL) is 2. For pad, line, via, and dogbone
recommendations, see Printed Wiring Board Tech for 1.0 mm Pitch Modules.
Note: Use the A01 corner designation for correct placement. Use the five plated dots that form a right angle
(|_) to locate the A01 corner as shown in Figure 4-2 on page 30.
750flds60.fm.6.0
April 27, 2007
A01
Corner
GND
GND
V
OV
DD
DD
OV
GND
DD
GND
OV
GND
V
DD
DD
OV
V
DD
DD
GND
GND
PowerPC 750FL RISC Microprocessor
Dimensions and Signal Assignments
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