IBM25PPC750FL-GR0133T IBM MICROELECTRONICS, IBM25PPC750FL-GR0133T Datasheet - Page 61

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IBM25PPC750FL-GR0133T

Manufacturer Part Number
IBM25PPC750FL-GR0133T
Description
MPU 750xx RISC 32-Bit 0.13um 600MHz 1.8V/2.5V/3.3V 750-Pin CBGA Tray
Manufacturer
IBM MICROELECTRONICS
Datasheet

Specifications of IBM25PPC750FL-GR0133T

Package
750CBGA
Device Core
PowerPC
Family Name
750xx
Number Of Cpu Cores
1
Data Bus Width
32 Bit
Maximum Speed
600 MHz
I/o Voltage
1.8|2.5|3.3 V
Operating Temperature
-40 to 105 °C
Preliminary
5.8.4 Heat Sink Mounting
Figure 5-10. Exploded Cross-Sectional View of Package with Several Heat Sink Options
Table 5-8. Maximum Heatsink Weight Limit for the CBGA
5.8.5 Thermal Assist Unit
The thermal sensor in the thermal assist unit (TAU) has not been characterized to determine the basic uncal-
ibrated accuracy. The relationship between the actual junction temperature and the temperature indicated by
THRM1 and THRM2 is not well known.
IBM recommends that the TAU in these devices be calibrated before use. Calibration methods are discussed
in the IBM Application Note, Calibrating the Thermal Assist Unit in the IBM25PPC750L Processors. Although
this note was written for the 750L microprocessor, the calibration methods discussed in this document also
apply to the 750FL microprocessor.
In rare cases, the basic error of the TAU can be so large that a useful calibration cannot be achieved.
750flds60.fm.6.0
April 27, 2007
Maximum dynamic compressive force allowed on the BGA balls
Maximum dynamic tensile force allowed on the BGA balls
Maximum dynamic compressive force allowed on the chip
Maximum mass of module + heatsink when heatsink is not bolted to card
Heat Sink Clip
Heat Sink
Printed
Circuit
Board
Adhesive
Thermal
Interface
Material
or
Force
CBGA Package
Option
PowerPC 750FL RISC Microprocessor
System Design Information
Maximum
42.9 N
9.05 N
14.8 N
50 g
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