AD9125 Analog Devices, AD9125 Datasheet - Page 7

• Manufacturer Part Number: AD9125
• Manufacturer: Analog Devices

Specifications of AD9125

• Resolution (bits): 16bit
• Dac Update Rate: 1GSPS
• Dac Settling Time: n/a
• Max Pos Supply (v): +3.47V
• Single-supply: No
• Dac Type: Current Out
• Dac Input Format: Par

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33
IOVDD
DVDD18, CVDD18
AVSS
EPAD
CVSS
DVSS
FSADJ, REFIO,
D[31:0], FRAME, DCI
DACCLKP/DACCLKN,
RESET, IRQ, CS, SCLK,
Junction Temperature
Storage Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
IOUT1P/IOUT1N,
IOUT2P/IOUT2N
REFCLKP/REFCLKN
SDIO, SDO
Range
With
Respect To
AVSS, EPAD,
CVSS, DVSS
AVSS, EPAD,
CVSS, DVSS
AVSS, EPAD,
CVSS, DVSS
EPAD, CVSS,
DVSS
AVSS, CVSS,
DVSS
AVSS, EPAD,
DVSS
AVSS, EPAD,
CVSS
AVSS
EPAD, DVSS
DVSS
EPAD, DVSS
−0.3 V to DVDD18 + 0.3 V
−0.3 V to IOVDD + 0.3 V
Rating
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
125°C
−65°C to +150°C
Rev. 0 | Page 7 of 56
THERMAL RESISTANCE
The exposed paddle (EPAD) must be soldered to the ground
plane for the 72-lead LFCSP. The EPAD performs as an
electrical and thermal connection to the board.
Typical θ
still air. Airflow increases heat dissipation, effectively reducing
θ
Table 7. Thermal Resistance
Package
72-Lead LFCSP
ESD CAUTION
JA
and θ
JB
JA
.
, θ
JB
, and θ
JC
θ
20.7
values are specified for a 4-layer board in
JA
θ
10.9
JB
θ
1.1
JC
Unit
°C/W
Conditions
EPAD soldered
AD9125