kfm2g16q2m-deb8 Samsung Semiconductor, Inc., kfm2g16q2m-deb8 Datasheet - Page 60

• Manufacturer Part Number: kfm2g16q2m-deb8
• Description: 2gb Muxonenand M-die
• Manufacturer: Samsung Semiconductor, Inc.

2.8.6
2.8.7
MuxOneNAND2G(KFM2G16Q2M-DEBx)
MuxOneNAND4G(KFN4G16Q2M-DEBx)
MuxOneNAND8G(KFK8G16Q2M-DEBx)
This Read register describes the size of the Boot Buffer.
F004h, default = 0200h
This Read register describes the number of each Buffer.
F005h, default = 0201h
Number of Buffers Information
2.8.8
This Read register describes the internal NAND array technology.
F006h, default = 0000h
Technology Information
15
15
15
Register Information
Register Information
DataBufAmount
BootBufAmount
14
14
14
Technology
BootBufSize
NAND MLC
NAND SLC
Reserved
Boot Buffer Size Register F004h (R)
Number of Buffers Register F005h (R)
Technology Register F006h (R)
13
13
13
DataBufAmount
12
12
12
11
11
11
10
10
10
9
9
9
Total boot buffer size in Words equal to 1 buffer of 512 Words
BootBufSize
8
8
8
The number of data buffers = 2 (2
The number of boot buffers = 1 (2
Tech
(1 x 512 = 2
60
7
7
7
Register Setting
0002h ~ FFFFh
9
6
6
Description
Description
) in the memory interface
6
0000h
0001h
5
5
5
BootBufAmount
4
4
4
N
N
FLASH MEMORY
, N=1)
, N=0)
3
3
3
2
2
2
1
1
1
0
0
0