MC68HC908JK3EMP MOTOROLA [Motorola, Inc], MC68HC908JK3EMP Datasheet - Page 213

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MC68HC908JK3EMP

Manufacturer Part Number
MC68HC908JK3EMP
Description
Microcontrollers
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
19.5 28-Pin PDIP
19.6 28-Pin SOIC
MC68H(R)C908JL3E/JK3E/JK1E
MOTOROLA
28
1
H
28
1
28X
G
26X
0.010 (0.25)
D
G
-A-
F
A
M
T
A
Figure 19-4. 28-Pin SOIC (Case #751F)
Figure 19-3. 28-Pin PDIP (Case #710)
S
D
14
15
Rev. 2.0
B
SEATING
PLANE
S
N
B
14
15
K
K
-B-
Mechanical Specifications
C
C
SEATING
PLANE
-T-
R
14X
X 45
P
0.010 (0.25)
M
L
J
M
B
M
M
J
NOTES:
F
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
FORMED PARALLEL.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
DIM
15.24 BSC
M
2.54 BSC
A
B
C
D
F
G
K
P
R
J
17.80
10.01
MILLIMETERS
Mechanical Specifications
37.21
14.22
MIN
MAX
7.40
2.35
0.35
0.41
0.23
0.13
0.25
5.08
0.56
1.52
2.16
0.38
3.43
1.02
15°
1.27 BSC
18.05
10.55
MAX
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.020
0.115
7.60
2.65
0.49
0.90
0.32
0.29
0.75
MIN
0.600 BSC
0.100 BSC
INCHES
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0.395
0.010
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
MAX
MIN
15°
0.050 BSC
INCHES
Technical Data
28-Pin PDIP
0.299
0.104
0.019
0.035
0.013
0.415
0.029
MAX
0.711
0.011
213

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