MT48LC8M16A2P-75:G Micron Technology Inc, MT48LC8M16A2P-75:G Datasheet - Page 38

IC SDRAM 128MBIT 133MHZ 54TSOP

MT48LC8M16A2P-75:G

Manufacturer Part Number
MT48LC8M16A2P-75:G
Description
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr

Specifications of MT48LC8M16A2P-75:G

Memory Type
SDRAM
Format - Memory
RAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Memory Configuration
16M X 8
Access Time
5.4ns
Page Size
128Mbit
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant

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Quantity
Price
Part Number:
MT48LC8M16A2P-75:G
Manufacturer:
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Quantity:
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Manufacturer:
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Figure 29:
BURST READ/SINGLE WRITE
Concurrent Auto Precharge
READ with Auto Precharge
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
Clock Suspend During READ Burst
Notes:
COMMAND
1. For this example, CL = 2, BL = 4 or greater, and DQM is LOW.
The burst read/single write mode is entered by programming the write burst mode bit
(M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the
access of a single column location (burst of one), regardless of the programmed BL.
READ commands access columns according to the programmed BL and sequence, just
as in the normal mode of operation (M9 = 0).
An access command (READ or WRITE) to another bank while an access command with
auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM
supports concurrent auto precharge. Micron SDRAMs support concurrent auto
precharge. Four cases where concurrent auto precharge occurs are defined below.
• Interrupted by a READ (with or without auto precharge): A READ to bank m will inter-
• Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will
INTERNAL
ADDRESS
rupt a READ on bank n, CL later. The precharge to bank n will begin when the READ
to bank m is registered (Figure 30 on page 39).
interrupt a READ on bank n when registered. DQM should be used 2 clocks prior to
the WRITE command to prevent bus contention. The precharge to bank n will begin
when the WRITE to bank m is registered (Figure 31 on page 39).
CLOCK
CKE
CLK
DQ
T0
BANK,
COL n
READ
T1
NOP
38
T2
NOP
D
OUT
n
TRANSITIONING DATA
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T3
n + 1
D
OUT
T4
NOP
128Mb: x4, x8, x16 SDRAM
T5
NOP
n + 2
D
OUT
©1999 Micron Technology, Inc. All rights reserved.
DON’T CARE
T6
NOP
D
n + 3
OUT
Operations

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