MT41J256M8JE-15E:A Micron Technology Inc, MT41J256M8JE-15E:A Datasheet - Page 189

• Manufacturer Part Number: MT41J256M8JE-15E:A
• Description: IC DDR3 SDRAM 2GBIT 82FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr

Specifications of MT41J256M8JE-15E:A

• Format - Memory: RAM
• Memory Type: DDR3 SDRAM
• Memory Size: 2G (256M x 8)
• Speed: 667MHz
• Interface: Parallel
• Voltage - Supply: 1.425 V ~ 1.575 V
• Operating Temperature: 0°C ~ 95°C
• Package / Case: 82-FBGA
• Organization: 256Mx8
• Address Bus: 18b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

On-Die Termination (ODT)
Figure 108: On-Die Termination
Functional Representation of ODT
Nominal ODT
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
ODT is a feature that enables the DRAM to enable/disable and turn on/off termination
resistance for each DQ, DQS, DQS#, and DM for the x4 and x8 configurations (and
TDQS, TDQS# for the x8 configuration, when enabled). ODT is applied to each DQ,
UDQS, UDQS#, LDQS, LDQS#, UDM, and LDM signal for the x16 configuration.
The ODT feature is designed to improve signal integrity of the memory channel by ena-
bling the DRAM controller to independently turn on/off the DRAM’s internal termina-
tion resistance for any grouping of DRAM devices. The ODT feature is not supported
during DLL disable mode (simple functional representation shown below). The switch
is enabled by the internal ODT control logic, which uses the external ODT ball and oth-
er control information.
The value of R
register bits (see Table 85 (page 192)). The ODT ball is ignored while in self refresh
mode (must be turned off prior to self refresh entry) or if mode registers MR1 and MR2
are programmed to disable ODT. ODT is comprised of nominal ODT and dynamic ODT
modes and either of these can function in synchronous or asynchronous mode (when
the DLL is off during precharge power-down or when the DLL is synchronizing). Nomi-
nal ODT is the base termination and is used in any allowable ODT state. Dynamic ODT
is applied only during writes and provides OTF switching from no R
R
The actual effective termination, R
nonlinearity of the termination. For R
istics (page 57).
ODT (NOM) is the base termination resistance for each applicable ball, it is enabled or
disabled via MR1[9, 6, 2] (see Mode Register 1 (MR1) Definition), and it is turned on or
off via the ODT ball.
To other
circuitry
such as
RCV,
. . .
TT(WR)
.
ODT
TT
Switch
(ODT termination value) is determined by the settings of several mode
R
TT
V
DDQ
189
/2
TT(EFF)
TT(EFF)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
, may be different from the R
DQ, DQS, DQS#,
DM, TDQS, TDQS#
values and calculations, see ODT Character-
2Gb: x4, x8, x16 DDR3 SDRAM
On-Die Termination (ODT)
© 2006 Micron Technology, Inc. All rights reserved.
TT
TT
or R
targeted due to
TT,nom
to