MT41J256M8JE-15E:A Micron Technology Inc, MT41J256M8JE-15E:A Datasheet - Page 31

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MT41J256M8JE-15E:A

Manufacturer Part Number
MT41J256M8JE-15E:A
Description
IC DDR3 SDRAM 2GBIT 82FBGA
Manufacturer
Micron Technology Inc
Type
DDR3 SDRAMr
Datasheets

Specifications of MT41J256M8JE-15E:A

Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
2G (256M x 8)
Speed
667MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
82-FBGA
Organization
256Mx8
Address Bus
18b
Maximum Clock Rate
1.333GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT41J256M8JE-15E:A
Manufacturer:
MICRON
Quantity:
985
Part Number:
MT41J256M8JE-15E:A
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Thermal Characteristics
Figure 13: Thermal Measurement Point
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
Notes:
Table 8: Thermal Characteristics
Parameter/Condition
Operating case temperature
Junction-to-case (TOP)
L
1. MAX operating case temperature. T
2. A thermal solution must be designed to ensure the DRAM device does not exceed the
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T
4. If T
5. The thermal resistance data is based off of a number of samples from multiple lots and
maximum T
ing operation.
3.9µs interval refresh rate. The use of SRT or ASR (if available) must be enabled.
should be viewed as a typical number.
(L/2)
C
exceeds +85°C, the DRAM must be refreshed externally at 2X refresh, which is a
C
during operation.
W
31
78-ball “HX”
78-ball “DA”
82-ball “JE”
96-ball “HA”
(W/2)
C
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package.
T c test point
2Gb: x4, x8, x16 DDR3 SDRAM
0 to +85
0 to +95
Value
tbd
3.9
1.6
3.9
Thermal Characteristics
Units
°C/W
°C
C
© 2006 Micron Technology, Inc. All rights reserved.
Symbol
ΘJC
T
T
C
C
1, 2, 3, 4
Notes
1, 2, 3
5
C
dur-

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