STEVAL-IFW001V1 STMicroelectronics, STEVAL-IFW001V1 Datasheet - Page 98
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STEVAL-IFW001V1
Manufacturer Part Number
STEVAL-IFW001V1
Description
BOARD EVAL BASED ON STR912FA
Manufacturer
STMicroelectronics
Datasheets
1.STEVAL-IFW001V1.pdf
(102 pages)
2.STEVAL-IFW001V1.pdf
(9 pages)
3.STEVAL-IFW001V1.pdf
(7 pages)
Specifications of STEVAL-IFW001V1
Design Resources
STEVAL-IFW001V1 Gerber Files STEVAL-IFW001V1 Schematic STEVAL-IFW001V1 Bill of Material
Main Purpose
Interface, Ethernet
Embedded
Yes, MCU, 32-Bit
Utilized Ic / Part
E-STE101P, STR912FAW44
Primary Attributes
Dual Ethernet Transceivers for Full Duplex Communication
Secondary Attributes
Up to 32 MII Addresses, UART, I2C, SPI, with RJ45 Connectors
Silicon Manufacturer
ST Micro
Core Architecture
ARM
Core Sub-architecture
ARM9
Silicon Core Number
STR9
Silicon Family Name
STR91x
For Use With
497-8263 - BOARD EXTENSION STEVAL-IFW001V1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8262
Package mechanical data
9.1
9.2
98/102
Figure 43. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
ECOPACK
To meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions, and product status are available at www.st.com.
Thermal characteristics
The average chip-junction temperature, T
The average chip-junction temperature, T
following equation:
Where:
●
●
●
●
P
Most of the time for the applications P
P
and/or memories. The worst case P
2.0 V).
An approximate relationship between P
Therefore (solving equations 1 and 2):
Where:
●
I/O
I/O
represents the power dissipation on input and output pins;
may be significant if the device is configured to drive continuously external modules
T
Θ
P
P
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
and T
A
JA
D
INT
is the ambient temperature in ° C,
is the sum of P
is the package junction-to-ambient thermal resistance, in ° C/W,
is the product of I
J
may be obtained by solving equations (1) and (2) iteratively for any value of T
T
P
K = P
J
D
Dpad
Dsm
= T
D
= K / (T
(at equilibrium) for a known T
D
A
x (T
+ (P
INT
J
A
D
and P
+ 273 °C)
DD
+ 273 °C) + Θ
x Θ
and V
Doc ID 13495 Rev 6
JA
I/O
)
INT
(P
DD
I/O
D
, expressed in Watts. This is the Chip Internal Power.
of the STR91xFA is 500 mW (I
D
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
= P
< P
JA
J
and T
J
, in degrees Celsius, may be calculated using the
must never exceed 125 °C.
INT
INT
x P
+ P
D
J
and may be neglected. On the other hand,
2
(if P
A.
I/O
Using this value of K, the values of P
I/O
),
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
(1)
(2)
(3)
is neglected) is given by:
DD
x V
DD
STR91xFAxxx
, or 250 mA x
D
A
.