OM11014 NXP Semiconductors, OM11014 Datasheet - Page 55

• Manufacturer Part Number: OM11014
• Description: BOARD EVAL FOR LPC2919
• Manufacturer: NXP Semiconductors
• Series: Keilr
• Type: MCUr

Specifications of OM11014

• Contents: Board, Cable, CD
• For Use With/related Products: LPC2919
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• Other names: 568-4360

NXP Semiconductors
Table 30.
V
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
LPC2917_19_1
Product data sheet
Symbol
Power-up reset
V
V
V
DD(CORE)
trip(high)
trip(low)
trip(dif)
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
level. Cased products are tested at T
the specified temperature and power-supply voltage range.
Leakage current is exponential to temperature; worst-case value is at 125 C T
down.
For Port 0, pin 0 to pin 15 add maximum 1.5 pF for input capacitance to ADC. For Port 0, pin 16 to pin 31 add maximum 1.0 pF for input
capacitance to ADC.
This value is the minimum drive capability. Maximum short-circuit output current is 33 mA (drive HIGH-level, shorted to ground) or
C
The power-up reset has a time filter: V
V
Not 5 V-tolerant when pull-up is on.
For I/O Port 0, the maximum input voltage is defined by V
This parameter is not part of production testing or final testing, hence only a typical value is stated. Maximum and minimum values are
based on simulation results.
38 mA. (drive LOW-level, shorted to V
trip(low)
xtal
is crystal load capacitance and C
= V
for 11 s before internal reset is asserted.
Static characteristics
DD(OSC_PLL)
Parameter
high trip level voltage
low trip level voltage
difference between high
and low trip level voltage
; V
DD(IO)
= 2.7 V to 3.6 V; V
…continued
amb
ext
DD(CORE)
DD(IO)
= 25 C (final testing). Both pre-testing and final testing use correlated test conditions to cover
are the two external load capacitors.
Conditions
). The device will be damaged if multiple outputs are shorted.
must be above V
Rev. 01 — 31 July 2008
DDA(ADC3V3)
I(ADC)
.
trip(high)
= 3.0 V to 3.6 V; T
for 2 s before reset is de-asserted; V
[6]
[6]
[6]
vj
. All clocks off. Analog modules and flash powered
Min
1.1
1.0
50
ARM9 microcontroller with CAN and LIN
vj
= -40 C to +125 C; all voltages are
Typ
1.4
1.3
120
[1]
LPC2917/19
Max
1.6
1.5
180
DD(CORE)
© NXP B.V. 2008. All rights reserved.
amb
= 125 C on wafer
must be below
55 of 67
Unit
V
V
mV