LPC3130FET180,551 NXP Semiconductors, LPC3130FET180,551 Datasheet - Page 5

• Manufacturer Part Number: LPC3130FET180,551
• Description: IC ARM9 MCU 180MHZ 180-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3130FET180,551

• Package / Case: 180-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Program Memory Type: ROMless
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJ-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 96 KB
• Interface Type: I2C/I2S/UART/USB
• Maximum Clock Frequency: 180 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: LPC3000
• Device Core: ARM926EJ-S
• Device Core Size: 16/32Bit
• Frequency (max): 180MHz
• Program Memory Size: Not Required
• Total Internal Ram Size: 96KB
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 1.2/1.8/2.8/3.3/5V
• Operating Supply Voltage (max): 1.3/3.6V
• Operating Supply Voltage (min): 1/1.1/1.65/2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 180
• Package Type: TFBGA
• Package: 180TFBGA
• Family Name: LPC3000
• Maximum Speed: 180 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4850 - KIT EVAL FOR LPC313X568-4062 - DEBUGGER J-LINK JTAG568-4061 - DEBUGGER U-LINK2 JTAG FOR NXP
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4696; 935288013551; LPC3130FET180-S

NXP Semiconductors
Table 3.
LPC3130_3131
Preliminary data sheet
Pin Symbol
Row E
1
5
9
13
Row F
1
5
13
Row G
1
5
13
Row H
1
5
13
Row J
1
5
13
Row K
1
5
9
13
Row L
1
5
9
13
Row M
1
5
9
13
Row N
1
5
9
13
EBI_D_3
VDDE_IOA
VSSA12
I2C_SCL1
EBI_D_2
VDDE_IOA
I2SRX_WS1
EBI_NCAS_BLOUT_0
VDDE_IOA
SYSCLK_O
EBI_DQM_0_NOE
VDDE_IOA
GPIO11
NAND_NCS_0
USB_RREF
GPIO15
NAND_NCS_2
mLCD_DB_12
TDI
GPIO20
USB_VDDA12_PLL
mLCD_DB_9
VSSE_IOC
VSSE_IOC
USB_ID
VDDE_IOB
VDDE_IOB
mI2STX_DATA0
USB_GNDA
mLCD_DB_8
mLCD_RW_WR
mUART_CTS_N
Pin allocation table
Pin Symbol
2
6
10
14
2
10
14
2
10
14
2
10
14
2
10
14
2
6
10
14
2
6
10
14
2
6
10
14
2
6
10
14
…continued
EBI_D_4
mNAND_RYBN0
VDDA12
I2STX_BCK1
EBI_D_1
SCAN_TDO
I2SRX_BCK1
EBI_D_0
I2STX_WS1
I2SRX_DATA1
EBI_NRAS_BLOUT_1
GPIO12
RSTIN_N
EBI_NWE
GPIO1
GPIO14
NAND_NCS_3
mLCD_DB_6
GPIO0
GPIO18
USB_VBUS
VSSI
VDDE_IOC
GPIO2
USB_VDDA33_DRV
VSSE_IOB
I2SRX_DATA0
TCK
USB_DM
mLCD_DB_2
I2SRX_BCK0
mI2STX_CLK0
All information provided in this document is subject to legal disclaimers.
Rev. 1.04 — 27 May 2010
Pin Symbol
3
7
11
-
3
11
3
11
-
3
11
-
3
11
-
3
7
11
-
3
7
11
-
3
11
-
3
7
11
-
Low-cost, low-power ARM926EJ-S microcontrollers
-
7
EBI_D_14
mNAND_RYBN1
ARM_TDO
-
EBI_D_15
BUF_TRST_N
-
EBI_D_12
VSSE_IOC
-
VDDI
GPIO19
-
NAND_NCS_1
GPIO16
-
VSSE_IOA
mLCD_DB_10
VDDE_IOC
-
USB_VSSA_TERM
VDDI
VSSI
-
VSSE_IOB
VDDE_IOB
mI2STX_WS0
-
mLCD_DB_15
mLCD_DB_4
JTAGSEL
-
LPC3130/3131
Pin Symbol
4
8
12
-
4
12
-
4
12
-
4
12
-
4
12
-
4
8
12
-
4
8
12
-
4
8
12
-
4
8
12
-
VSSE_IOA
VDDE_IOC
I2C_SDA1
-
VSSE_IOA
I2STX_DATA1
-
VSSI
VDDE_IOC
-
VSSE_IOA
CLK_256FS_O
-
CLOCK_OUT
GPIO13
-
USB_VSSA_REF
mLCD_CSB
GPIO17
-
VDDE_IOB
mLCD_E_RD
VDDI
-
VSSE_IOB
VSSE_IOB
mI2STX_BCK0
-
mLCD_DB_11
mLCD_DB_0
UART_TXD
-
© NXP B.V. 2010. All rights reserved.
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