MCU 32KB FLASH EEPROM 32-VFQFPN

STM8S105K6U6

Manufacturer Part NumberSTM8S105K6U6
DescriptionMCU 32KB FLASH EEPROM 32-VFQFPN
ManufacturerSTMicroelectronics
SeriesSTM8S
STM8S105K6U6 datasheet
 

Specifications of STM8S105K6U6

Core ProcessorSTM8Core Size8-Bit
Speed16MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTNumber Of I /o25
Program Memory Size32KB (32K x 8)Program Memory TypeFLASH
Eeprom Size1K x 8Ram Size2K x 8
Voltage - Supply (vcc/vdd)2.95 V ~ 5.5 VData ConvertersA/D 7x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case32-VFQFN, 32-VFQFPNProcessor SeriesSTM8S10x
CoreSTM8Data Bus Width8 bit
Data Ram Size2 KBInterface TypeI2C, SPI, UART
Maximum Clock Frequency16 MHzNumber Of Programmable I/os25
Number Of Timers8Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWSTM8
Development Tools By SupplierSTICE-SYS001Minimum Operating Temperature- 40 C
On-chip Adc10 bit, 7 ChannelFor Use With497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names497-10123
STM8S105K6U6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
Page 101
102
Page 102
103
Page 103
104
Page 104
105
Page 105
106
Page 106
107
Page 107
108
Page 108
109
Page 109
110
Page 110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
Page 109/127

Download datasheet (2Mb)Embed
PrevNext
STM8S105xx
11.4
32-lead VFQFPN package mechanical data
Figure 50: 32-lead very thin fine pitch quad flat no-lead package (5 x 5)
1. There is an exposed die pad on the underside of the VFQFPN package. It is recommended
to connect and solder this backside pad to PCB ground.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
Table 55: 32-lead very thin fine pitch quad flat no-lead package mechanical data
Dim.
mm
Min
A
0.80
A1
0
A3
b
0.18
D
4.85
Seating plane
C
A3
D
e
16
9
8
E2
b
1
32
Pin # 1 ID
R = 0.30
D2
Bottom view
Typ
Max
0.90
1.00
0.02
0.05
0.20
0.25
0.30
5.00
5.15
DocID14771 Rev 10
Package information
ddd C
A
A1
17
E
24
L
L
42_ME
(1)
inches
Min
Typ
Max
0.0315
0.0354
0.0394
0.0008
0.0020
0.0079
0.0071
0.0098
0.0118
0.1909
0.1969
0.2028
109/127