MCU 32KB FLASH EEPROM 32-VFQFPN

STM8S105K6U6

Manufacturer Part NumberSTM8S105K6U6
DescriptionMCU 32KB FLASH EEPROM 32-VFQFPN
ManufacturerSTMicroelectronics
SeriesSTM8S
STM8S105K6U6 datasheet
 


Specifications of STM8S105K6U6

Core ProcessorSTM8Core Size8-Bit
Speed16MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTNumber Of I /o25
Program Memory Size32KB (32K x 8)Program Memory TypeFLASH
Eeprom Size1K x 8Ram Size2K x 8
Voltage - Supply (vcc/vdd)2.95 V ~ 5.5 VData ConvertersA/D 7x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case32-VFQFN, 32-VFQFPNProcessor SeriesSTM8S10x
CoreSTM8Data Bus Width8 bit
Data Ram Size2 KBInterface TypeI2C, SPI, UART
Maximum Clock Frequency16 MHzNumber Of Programmable I/os25
Number Of Timers8Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWSTM8
Development Tools By SupplierSTICE-SYS001Minimum Operating Temperature- 40 C
On-chip Adc10 bit, 7 ChannelFor Use With497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names497-10123
STM8S105K6U6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
Page 111
112
Page 112
113
Page 113
114
Page 114
115
Page 115
116
Page 116
117
Page 117
118
Page 118
119
Page 119
120
Page 120
121
122
123
124
125
126
127
Page 114/127

Download datasheet (2Mb)Embed
PrevNext
Thermal characteristics
12
Thermal characteristics
The maximum chip junction temperature (T
Operating conditions
The maximum chip-junction temperature, T
the following equation:
T
= T
+ (P
Jmax
Amax
Where:
T
is the maximum ambient temperature in °C
Amax
Θ
is the package junction-to-ambient thermal resistance in ° C/W
JA
P
is the sum of P
Dmax
P
is the product of I
INTmax
power.
P
represents the maximum power dissipation on output pinsWhere:P
I/Omax
+ Σ((V
-V
DD
OH)
and high level in the application.
Symbol
Parameter
Θ
Thermal resistance junction-ambient
JA
LQFP 48 - 7 x 7 mm
Θ
Thermal resistance junction-ambient
JA
LQFP 44 - 10 x 10 mm
Θ
Thermal resistance junction-ambient
JA
LQFP 32 - 7 x 7 mm
Θ
Thermal resistance junction-ambient
JA
VQFPN 32 - 5 x 5 mm
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
convection environment.
12.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural convection
(still air). Available from www.jedec.org.
114/127
J max
, in degrees Celsius, may be calculated using
Jmax
x Θ
)
Dmax
JA
and P
(P
INTmax
I/Omax
Dmax
andV
, expressed in Watts. This is the maximum chip internal
DD
DD
*I
), taking into account the actual V
OH
Table 58: Thermal characteristics
DocID14771 Rev 10
) must never exceed the values given in
= P
+ P
)
INTmax
I/Omax
I/Omax
/I
V
/I
of the I/Os at low
OL
OL and
OH
OH
(1)
Value
57
54
60
22
STM8S105xx
=Σ (V
*I
)
OL
OL
Unit
°C/W
°C/W
°C/W
°C/W