MCF5471ZP200 Freescale Semiconductor, MCF5471ZP200 Datasheet - Page 19

• Manufacturer Part Number: MCF5471ZP200
• Description: IC MPU 32BIT COLDF 388-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF547xr

Specifications of MCF5471ZP200

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 99
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.43 V ~ 1.58 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 388-BGA
• Family Name: MCF5xxx
• Device Core: ColdFire V4e
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5/3.3V
• Operating Supply Voltage (max): 1.58/3.6V
• Operating Supply Voltage (min): 1.43/3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 388
• Package Type: BGA
• For Use With: M5475EVBGHS - KIT DEV GHS FOR M5475EVBM5474GFE - MODULE M5474 FIRE ENGINEM5474LITEKIT - KIT DEV FOR MCF547X
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Not Compliant

Freescale Semiconductor
1
2
3
4
5
6
7
8
9
10
11
Symbol
DD13
DD14
DD15
DD16
The frequency of operation is 2x or 4x the CLKIN frequency of operation. The MCF547X supports a single external
reference clock (CLKIN). This signal defines the frequency of operation for FlexBus and PCI, but SDRAM clock operates at
the same frequency as the internal bus clock. Please see the reset configuration signals description in the “Signal
Descriptions” chapter within the MCF547x Reference Manual.
SDCLK is one memory clock in (ns).
Pulse width high plus pulse width low cannot exceed max clock period.
Pulse width high plus pulse width low cannot exceed max clock period.
Command output valid should be 1/2 the memory bus clock (SDCLK) plus some minor adjustments for process,
temperature, and voltage variations.
This specification relates to the required input setup time of today’s DDR memories. SDDATA[31:24] is relative to SDDQS3,
SDDATA[23:16] is relative to SDDQS2, SDDATA[15:8] is relative to SDDQS1, and SDDATA[7:0] is relative SDDQS0.
The first data beat is valid before the first rising edge of SDDQS and after the SDDQS write preamble. The remaining data
beats is valid for each subsequent SDDQS edge.
This specification relates to the required hold time of today’s DDR memories. SDDATA[31:24] is relative to SDDQS3,
SDDATA[23:16] is relative to SDDQS2, SDDATA[15:8] is relative to SDDQS1, and SDDATA[7:0] is relative SDDQS0.
Data input skew is derived from each SDDQS clock edge. It begins with a SDDQS transition and ends when the last data
line becomes valid. This input skew must include DDR memory output skew and system level board skew (due to routing
or other factors).
Data input hold is derived from each SDDQS clock edge. It begins with a SDDQS transition and ends when the first data
line becomes invalid.
DDR memories typically have a minimum speed specification of 83 MHz. Check memory component specifications to verify.
DQS input read preamble width (t
DQS input read postamble width (t
DQS output write preamble width (t
DQS output write postamble width (t
Table 13. DDR Timing Specifications (continued)
Characteristic
MCF547x ColdFire
RPRE
RPST
WPRE
WPST
)
)
)
)
®
Microprocessor, Rev. 4
0.25
Min
0.9
0.4
0.4
Max
1.1
0.6
0.6
—
SDCLK
SDCLK
SDCLK
SDCLK
Unit
SDRAM Bus
Notes
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