MCF5471ZP200 Freescale Semiconductor, MCF5471ZP200 Datasheet - Page 5

• Manufacturer Part Number: MCF5471ZP200
• Description: IC MPU 32BIT COLDF 388-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF547xr

Specifications of MCF5471ZP200

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 99
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.43 V ~ 1.58 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 388-BGA
• Family Name: MCF5xxx
• Device Core: ColdFire V4e
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5/3.3V
• Operating Supply Voltage (max): 1.58/3.6V
• Operating Supply Voltage (min): 1.43/3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 388
• Package Type: BGA
• For Use With: M5475EVBGHS - KIT DEV GHS FOR M5475EVBM5474GFE - MODULE M5474 FIRE ENGINEM5474LITEKIT - KIT DEV FOR MCF547X
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Not Compliant

3
Table 4
and IV
Freescale Semiconductor
External (I/O pads) operation voltage range
Memory (I/O pads) operation voltage range (DDR Memory)
Internal logic operation voltage range
PLL Analog operation voltage range
USB oscillator operation voltage range
USB digital logic operation voltage range
USB PHY operation voltage range
USB oscillator analog operation voltage range
USB PLL operation voltage range
Input high voltage SSTL 3.3V/2.5V
Input low voltage SSTL 3.3V/2.5V
Input high voltage 3.3V I/O pins
Input low voltage 3.3V I/O pins
1
2
3
4
5
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
DD
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the Ψ
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
lists DC electrical operating temperatures. This table is based on an operating voltage of EV
JA
of 1.5 ± 0.07 V
and Ψ
DC Electrical Specifications
jt
parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection. Freescale
Characteristic
DC
.
JA
and power dissipation specifications in the system design to prevent device junction
Characteristic
2
2
1
Table 3. Thermal Resistance (continued)
1
MCF547x ColdFire
Table 4. DC Electrical Specifications
Four layer board (2s2p)
Natural convection
®
Microprocessor, Rev. 4
USB_OSCAV
USB_PHYV
USB_PLLV
USB_OSV
PLL V
USBV
Symbol
SD V
—
—
EV
IV
V
V
V
V
DD
IH
IH
IL
IL
DD
DD
DD
DD
DD
DD
DD
DD
0.7 x EV
V
V
V
REF
Symbol
SS
SS
2.30
1.43
1.43
1.43
1.43
Min
θ
3.0
3.0
3.0
3.0
θ
θ
Ψ
JMA
- 0.3
- 0.3
JB
JC
+ 0.3
jt
DD
DC Electrical Specifications
SD V
0.35 x EV
Value
EV
16
DD
V
2
11
7
1,5
REF
1,2
4
DD
3
Max
2.70
1.58
1.58
1.58
1.58
= 3.3 V
3.6
3.6
3.6
3.6
DD
- 0.3
+ 0.3
+ 0.3
DD
DC
Unit
°C/W
°C/W
°C/W
°C/W
± 0.3 V
Units
V
V
V
V
V
V
V
V
V
V
V
V
V
jt
DC
5