UJA1078ATW/5V0/WD, NXP Semiconductors, UJA1078ATW/5V0/WD, Datasheet - Page 32
UJA1078ATW/5V0/WD,
Manufacturer Part Number
UJA1078ATW/5V0/WD,
Description
IC SBC CAN/LIN 5.0V HS 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1078ATW3V3118.pdf
(54 pages)
Specifications of UJA1078ATW/5V0/WD,
Controller Type
System Basis Chip
Interface
CAN, LIN
Voltage - Supply
4.5 V ~ 28 V
Current - Supply
84µA
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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NXP Semiconductors
UJA1078A
Product data sheet
Table 9.
[1]
[2]
Symbol
R
Fig 16. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper
th(j-a)
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with
two inner copper layers (thickness: 35 μm) and thermal via array under the exposed pad connected to the
first inner copper layer.
R
(K/W)
th(j-a)
90
70
50
30
area
Parameter
thermal resistance from junction to
ambient
Thermal characteristics
0
with heatsink top layer
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 January 2011
2
without heatsink top layer
High-speed CAN/dual LIN core system basis chip
4
Conditions
single-layer board
four-layer board
6
PCB Cu heatsink area (cm
8
UJA1078A
015aaa138
© NXP B.V. 2011. All rights reserved.
2
[1]
[2]
)
Typ
78
36
10
Unit
K/W
K/W
32 of 54
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