SC16C2550BIA44 NXP Semiconductors, SC16C2550BIA44 Datasheet - Page 43

• Manufacturer Part Number: SC16C2550BIA44
• Description: UART, 2 CH, 16BYTE FIFO, 16C2550
• Manufacturer: NXP Semiconductors

Specifications of SC16C2550BIA44

• Data Rate: 5Mbps
• Transmit Fifo: 16Byte
• Receive Fifo: 16Byte
• Transmitter And Receiver Fifo Counter: Yes
• Package Type: PLCC
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 44
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Number Of Channels: 2
• No. Of Channels: 2
• Supply Voltage Range: 2.25V To 5.5V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: PLCC
• No. Of Pins: 44
• Svhc: No SVHC (18-Jun-2010)
• Operating: RoHS Compliant
• Uart Features: Independent Transmit & Receive UART Control, Software Selectable Baud Rate Generator
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
18. Contents
1
2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7
7.1
7.2
7.2.1
7.2.2
7.3
7.3.1
7.3.1.1
7.3.1.2
7.3.2
7.4
7.5
7.6
7.7
7.8
7.9
7.10
8
9
10
10.1
11
12
12.1
12.2
12.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 9
Register descriptions . . . . . . . . . . . . . . . . . . . 15
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25
Static characteristics. . . . . . . . . . . . . . . . . . . . 25
Dynamic characteristics . . . . . . . . . . . . . . . . . 26
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 33
Soldering of SMD packages . . . . . . . . . . . . . . 37
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
UART A-B functions . . . . . . . . . . . . . . . . . . . . . 9
Internal registers. . . . . . . . . . . . . . . . . . . . . . . 10
FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . 11
Hardware/software and time-out interrupts. . . 11
Programmable baud rate generator . . . . . . . . 12
DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 13
Loopback mode . . . . . . . . . . . . . . . . . . . . . . . 13
Transmit Holding Register (THR) and Receive
Holding Register (RHR) . . . . . . . . . . . . . . . . . 15
Interrupt Enable Register (IER) . . . . . . . . . . . 16
IER versus Transmit/Receive FIFO interrupt
mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17
IER versus Receive/Transmit FIFO polled
mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17
FIFO Control Register (FCR) . . . . . . . . . . . . . 17
DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Mode 0 (FCR bit 3 = 0) . . . . . . . . . . . . . . . . . . 17
Mode 1 (FCR bit 3 = 1) . . . . . . . . . . . . . . . . . . 17
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Interrupt Status Register (ISR) . . . . . . . . . . . . 19
Line Control Register (LCR) . . . . . . . . . . . . . . 20
Modem Control Register (MCR) . . . . . . . . . . . 21
Line Status Register (LSR) . . . . . . . . . . . . . . . 22
Modem Status Register (MSR). . . . . . . . . . . . 23
Scratchpad Register (SPR) . . . . . . . . . . . . . . 24
SC16C2550B external reset condition . . . . . . 24
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 27
Introduction to soldering . . . . . . . . . . . . . . . . . 37
Wave and reflow soldering . . . . . . . . . . . . . . . 37
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 37
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
12.4
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Soldering of through-hole mount packages . 39
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
Revision history . . . . . . . . . . . . . . . . . . . . . . . 41
Legal information . . . . . . . . . . . . . . . . . . . . . . 42
Contact information . . . . . . . . . . . . . . . . . . . . 42
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 38
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Soldering by dipping or by solder wave . . . . . 39
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 39
Package related soldering information . . . . . . 40
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
SC16C2550B
Document identifier: SC16C2550B_5
Date of release: 12 January 2009
All rights reserved.