LTC2494IUHF#PBF Linear Technology, LTC2494IUHF#PBF Datasheet - Page 36

IC ADC 16BIT W/PGA 38-QFN

LTC2494IUHF#PBF

Manufacturer Part Number
LTC2494IUHF#PBF
Description
IC ADC 16BIT W/PGA 38-QFN
Manufacturer
Linear Technology
Datasheet

Specifications of LTC2494IUHF#PBF

Number Of Bits
16
Sampling Rate (per Second)
15
Data Interface
MICROWIRE™, Serial, SPI™
Number Of Converters
1
Power Dissipation (max)
480µW
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
38-WFQFN, Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC2494IUHF#PBFLTC2494IUHF
Manufacturer:
LT
Quantity:
10 000
package Description
LTC2494

7.00 0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 0.05
OUTLINE M0-220 VARIATION WHKD
4.10 0.05
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 REF
5.00 0.10
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.15 ± 0.05
RECOMMENDED SOLDER PAD LAYOUT
(Reference LTC DWG # 05-08-1701 Rev C)
38-Lead Plastic QFN (5mm × 7mm)
5.15 ± 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 0.05
6.10 0.05
7.50 0.05
0.75 0.05
5.5 REF
UHF Package
5.50 REF
0.200 REF
0.00 – 0.05
0.50 BSC
0.25 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 0.05
5.15 ± 0.10
PACKAGE
OUTLINE
3.15 ± 0.10
3.00 REF
R = 0.125
TYP
37
38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 45 CHAMFER
R = 0.10
TYP
0.40 0.10
1
2
(UH) QFN REF C 1107
2494fd

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