MC8641DVU1333JE Freescale Semiconductor, MC8641DVU1333JE Datasheet - Page 121

• Manufacturer Part Number: MC8641DVU1333JE
• Description: IC MPU DUAL CORE E600 1023FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8641DVU1333JE

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.333GHz
• Voltage: 1.05V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Family Name: MPC8xxx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 1.333GHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.05V
• Operating Supply Voltage (max): 1.1V
• Operating Supply Voltage (min): 1V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 1023
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed

The following pins must be connected to GND:
For other directions on reserved or no-connects pins see
20.6
The MPC8641 requires weak pull-up resistors (2–10 kΩ is recommended) on all open drain type pins.
The following pins must NOT be pulled down during power-on reset: TSEC4_TXD[4], LGPL0/LSDA10,
LGPL1/LSDWE, TRIG_OUT/READY, and D1_MSRCID[2].
The following are factory test pins and require strong pull up resistors (100 Ω –1 kΩ) to OVDD
LSSD_MODE, TEST_MODE[0:3].The following pins require weak pull up resistors (2–10 kΩ) to their
specific power supplies: LCS[0:4], LCS[5]/DMA_DREQ2, LCS[6]/DMA_DACK[2],
LCS[7]/DMA_DDONE[2], IRQ_OUT, IIC1_SDA, IIC1_SCL, IIC2_SDA, IIC2_SCL, and
CKSTP_OUT.
The following pins should be pulled to ground with a 100-
SD2_IMP_CAL_TX. The following pins should be pulled to ground with a 200-
SD1_IMP_CAL_RX, SD2_IMP_CAL_RX.
TSECn_TX_EN signals require an external 4.7-k
Transmit Enable before it is actively driven.
When the platform frequency is 400 MHz, TSEC1_TXD[1] must be pulled down at reset.
TSEC2_TXD[4] and TSEC2_TX_ER pins function as cfg_dram_type[0 or 1] at reset and MUST BE
VALID BEFORE HRESET ASSERTION when coming out of device sleep mode.
20.6.1
The mechanical drawing for the single core device does not have all the solder balls that exist on the single
core device. This includes all the balls for VDD_Core1 and SENSEV
package for the dual core device, but not on the single core package. A solder ball is present for
SENSEV
Likewise, AV
Freescale Semiconductor
•
•
•
•
•
SDn_TX[7:0]
SDn_RX[7:0]
SDn_RX[7:0]
SDn_REF_CLK
SDn_REF_CLK
SS
Pull-Up and Pull-Down Resistor Requirements
_Core1 and needs to be connected to ground with a weak (2-10 k
Special instructions for Single Core device
DD
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
It is recommended to power down the unused lane through SRDS1CR1[0:7]
register (offset = 0xE_0F08) and SRDS2CR1[0:7] register
(offset = 0xE_0F44.) (This prevents the oscillations and holds the receiver
output in a fixed state.) that maps to SERDES lane 0 to lane 7 accordingly.
_Core1 needs to be pulled to ground as shown in
Ω
NOTE
pull down resistor to prevent PHY from seeing a valid
Section 17, “Signal
Ω
resistor: SD1_IMP_CAL_TX,
Figure
DD
_Core1 which exist on the
64.
Listings.”
Ω)
pull down resistor.
Ω
System Design Information
resistor:
121