MC8641DVU1333JE Freescale Semiconductor, MC8641DVU1333JE Datasheet - Page 122

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MC8641DVU1333JE

Manufacturer Part Number
MC8641DVU1333JE
Description
IC MPU DUAL CORE E600 1023FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC8641DVU1333JE

Processor Type
MPC86xx PowerPC 32-Bit
Speed
1.333GHz
Voltage
1.05V
Mounting Type
Surface Mount
Package / Case
1023-FCCBGA
Family Name
MPC8xxx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
1.333GHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.05V
Operating Supply Voltage (max)
1.1V
Operating Supply Voltage (min)
1V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
1023
Package Type
FCCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC8641DVU1333JE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
System Design Information
The mechanical drawing for the single core device is located in
the MPC8641
For other pin pull-up or pull-down recommendations of signals, please see
20.7
The MPC8641 drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I
To measure Z
or GND. Then, the value of each resistor is varied until the pad voltage is OV
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and R
OV
other in value. Then, Z
Table 73
nominal OV
122
DD
/2. R
summarizes the signal impedance targets. The driver impedances are targeted at minimum V
Output Buffer DC Impedance
P
DD
Note: Nominal supply voltages. See
then becomes the resistance of the pull-up devices. R
0
FC-CBGA.”
Impedance
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
for the single-ended drivers, an external resistor is connected from the chip pad to OV
, 105°C.
R
R
N
P
0
= (R
P
Configuration, Power
+ R
Figure 66. Driver Impedance Measurement
DUART, Control,
Data
Management
N
Table 73. Impedance Characteristics
43 Target
43 Target
)/2.
Table
1, T
j
= 105°C.
25 Target
25 Target
Express
2
PCI
C).
Pad
P
R
R
is trimmed until the voltage at the pad equals
OV
OGND
N
P
Section 16.2, “Mechanical Dimensions of
DD
DDR DRAM
P
20 Target
20 Target
and R
SW2
SW1
N
are designed to be close to each
Section 17, “Signal
Symbol
DD
Z
Z
/2 (see
0
0
Freescale Semiconductor
Unit
Figure
W
W
66). The
Listings.”
DD
DD
,

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