STM32F101VD STMicroelectronics, STM32F101VD Datasheet - Page 104

• Manufacturer Part Number: STM32F101VD
• Description: Mainstream Access line, ARM Cortex-M3 MCU with 384 Kbytes Flash, 36 MHz CPU
• Manufacturer: STMicroelectronics

Specifications of STM32F101VD

• Core: ARM 32-bit Cortex™-M3 CPU
• Conversion Range: 0 to 3.6 V
• Peripherals Supported: timers, ADC, DAC, SPIs, I2Cs and USARTs
• Systick Timer: a 24-bit downcounter

Package characteristics
6.2
6.2.1
104/112
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 64.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
Θ
JA
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
Thermal resistance junction-ambient
LQFP144 - 20 x 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
T
INT
) + Σ((V
J
Doc ID 14610 Rev 8
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
STM32F101xC, STM32F101xD, STM32F101xE
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
38.
/ I
OH
D
OH
),
max × Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
max + P
Value
30
46
45
I/O
max),
°C/W
Unit