TS8388BMFSB_Q Atmel Corporation, TS8388BMFSB_Q Datasheet - Page 44

• Manufacturer Part Number: TS8388BMFSB_Q
• Description: ADC 8-bit 1 Gsps.
• Manufacturer: Atmel Corporation

CBGA68 Board
Assembly with
External Heasink
Moisture
Characteristics
44
TS8388B
It is recommended to use an external heatsink or PCBoard special design.
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated
in the device.
Figure 49. CBGA68 Board Assembly
This device is sensitive to the moisture (MSL3 according to JEDEC standard):
Shelf life in sealed bag: 12 months at <40 C and <90% relative humidity (RH).
After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow,
or equivalent processing (peak package body temperature 220 C) must be:
•
•
Devices require baking, before mounting, if Humidity Indicator Card is >20% when read at
23 C ±5 C.
If baking is required, devices may be baked for:
•
•
mounted within 198 hours at factory conditions of 30 C/60% RH, or
stored at 20% RH.
192 hours at 40 C +5 C/-0 C and <5% RH for low-temperature device containers, or
24 hours at 125 C ±5 C for high temperature device containers.
24.2
20.2
50.5
31
Board
32.5
2144C–BDC–04/03