TS8388BMFSB_Q Atmel Corporation, TS8388BMFSB_Q Datasheet - Page 45

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TS8388BMFSB_Q

Manufacturer Part Number
TS8388BMFSB_Q
Description
ADC 8-bit 1 Gsps.
Manufacturer
Atmel Corporation
Datasheet
Nominal CQFP68
Thermal
Characteristics
Thermal Resistance
from Junction to
Ambient: RTHJA
2144C–BDC–04/03
Although the power dissipation is low for this performance, the use of a heat sink is
mandatory.
The user will find some advice on this topics below.
The following table lists the converter thermal performance parameters, with or without
heatsink.
For the following measurements, a 50 x 50 x 16 mm heatsink has been used (see Figure 51
on page 46).
Table 10. Thermal Resitance
Note:
Figure 50. Thermal Resistance from Junction to Ambient: Rthja
Air Flow
(m/s)
0.5
1.5
2.5
0
1
2
3
4
5
1. Heatsink is glued to backside of package or screwed and pressed with thermal grease.
Estimated – Without Heatsink
60
50
40
30
20
10
0
23.5
0
50
40
35
32
30
28
26
24
1
ja Thermal Resistance ( C/W)
CQFP68 on Board
Air flow (m/s)
2
3
Without heatsink
With heatsink
Targeted – With Heatsink
4
5
8.9
7.9
7.3
6.8
6.5
6.2
5.8
5.6
10
TS8388B
(1)
45

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