TS8388BMFSB_Q Atmel Corporation, TS8388BMFSB_Q Datasheet - Page 53

• Manufacturer Part Number: TS8388BMFSB_Q
• Description: ADC 8-bit 1 Gsps.
• Manufacturer: Atmel Corporation

Outline
Descriptions
Figure 54. Package Dimension – 68 Pins CBGA
2144C–BDC–04/03
Ball
A1 Index
other side
CBGA 68 package.
AL203 substrate.
Package design.
Corner balls (x4) are not connected (mechanical ball).
Balls : 1.27 mm pitch on 11x11 grid.
- A -
11
10
9
8
7
6
5
4
3
2
1
A
1.27
B
72x∅ D = 0.80 ± 0.10 mm
C
0.40
0.15
15.00 ± 0.15 mm
D
T A B
T
View balls side
E
(Position of array of balls / edges A and B)
(Position of balls within array)
7.84
F
G
H
J
K
L
Detail of
ball x2
- B -
Top side with
soldered R, C
devices
(using solder
Sn/Pb 63/37)
0.95 max
1.27 ref
0.63 ± 0.10
1.45 ± 0.12
- T -
Balls
Sn/Pb 63/37
All units in mm
AI203 Ceramic
Cap.
Glued and embedded
in substrate
TS8388B
Balls side
AI203 substrate
53