ISL6569ACR Intersil, ISL6569ACR Datasheet - Page 5

IC CTRLR PWM BUCK 2PHASE 32-QFN

ISL6569ACR

Manufacturer Part Number
ISL6569ACR
Description
IC CTRLR PWM BUCK 2PHASE 32-QFN
Manufacturer
Intersil
Datasheet

Specifications of ISL6569ACR

Pwm Type
Voltage/Current Mode
Number Of Outputs
1
Frequency - Max
2MHz
Duty Cycle
75%
Voltage - Supply
4.75 V ~ 5.25 V
Buck
Yes
Boost
No
Flyback
No
Inverting
No
Doubler
No
Divider
No
Cuk
No
Isolated
No
Operating Temperature
0°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Frequency-max
2MHz
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Manufacturer
Quantity
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Manufacturer:
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Quantity:
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Part Number:
ISL6569ACR
Manufacturer:
INTERSIL
Quantity:
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Part Number:
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Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Input, Output, or I/O Voltage . . . . . . . . . . . GND -0.3V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 3kV
Operating Conditions
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 0
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 0
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTES:
Electrical Specifications
1. θ
2. θ
3. For θ
VCC SUPPLY CURRENT
Nominal Supply
Shutdown Supply
SHUNT REGULATOR
VCC Voltage
VCC Sink Current
POWER-ON RESET AND ENABLE
POR Threshold
ENABLE Threshold
REFERENCE VOLTAGE AND DAC
Reference Voltage
System Accuracy
VID on Fly Step Size
VID Pull Up
VID Input Low Level
VID Input High Level
PIN-ADJUSTABLE OFFSET
OFS Current
Offset Accuracy
OSCILLATOR
Accuracy
Adjustment Range
Brief TB379.
JA
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
PARAMETER
5
Operating Conditions: VCC = 5V, T
VCC = 5VDC; EN = 5VDC; R
VCC = 5VDC; EN = 0VDC; R
VCC tied to 12VDC thru 300Ω resistor, R
VCC tied to 12VDC thru 300Ω resistor, R
VCC Rising
VCC Falling
EN Rising
Hysteresis
(Note 4)
R
ROFS = 5.00kΩ ±1%
T
= 100kΩ
o
C to 125
o
CC
C to 70
+ 0.3V
o
o
ISL6569A
C
C
TEST CONDITIONS
A
= 0
T
T
o
= 100 kΩ ±1%
= 100 kΩ ±1%
C to 70
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .300
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Notes 2, 3) . . . . . . . . . .
(SOIC - Lead Tips Only)
o
C. Unless Otherwise Specified.
T
T
= 100kΩ
= 100kΩ
1.205
0.792
MIN
5.63
4.25
3.75
47.0
0.08
-0.5
8.0
8.0
-10
15
86
-
-
-
-
-
θ
JA
TYP
10.8
10.3
4.35
3.85
1.23
1.36
50.0
100
5.8
0.8
-20
20
92
25
-
-
-
(
63
32
o
C/W) θ
1.255
0.808
MAX
December 29, 2004
14.0
13.0
5.97
4.50
4.00
53.0
0.5
0.8
1.6
1.0
25
98
10
-
-
-
o
C to 150
JC
N/A
UNITS
FN9092.2
(
%VID
MHz
o
4
mA
mA
mA
mV
mV
mV
µA
µA
%
C/W)
V
V
V
V
V
V
V
o
o
o
C
C
C

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