D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 543
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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13.3
13.3.1
The main functions of the smart card interface are as follows.
• One frame consists of 8-bit data plus a parity bit.
• In transmission, a guard time of at least 2 etu (1 etu in block transfer mode) (elementary time
• If a parity error is detected during reception, a low error signal level is output for one etu
• If the error signal is sampled during transmission, the same data is transmitted automatically
• Only asynchronous communication is supported; there is no synchronous communication
unit: the time for transfer of 1 bit) is left between the end of the parity bit and the start of the
next frame.
period, 10.5 etu after the start bit. (This does not apply to block transfer mode.)
after the elapse of 2 etu or longer. (This does not apply to block transfer mode.)
function.
Operation
Overview
Rev.7.00 Feb. 14, 2007 page 509 of 1108
Section 13 Smart Card Interface
REJ09B0089-0700
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