D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 651
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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AC Characteristics
Table 17.19 AC Characteristics in Auto-Program Mode
Conditions: V
Item
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Write pulse width
Status polling start time
Status polling access time
Address setup time
Address hold time
Memory write time
Write setup time
Write end setup time
WE rise time
WE fall time
CC
= 3.3 V ±0.3 V, V
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
wsts
spa
as
ah
write
pns
pnh
r
f
SS
= 0 V, T
a
= 25°C ±5°C
Min
20
0
0
50
50
70
1
—
0
60
1
100
100
—
—
Rev.7.00 Feb. 14, 2007 page 617 of 1108
Max
—
—
—
—
—
—
—
150
—
—
3000
—
—
30
30
Unit
μs
ns
ns
ns
ns
ns
ms
ns
ns
ns
ms
ns
ns
ns
ns
REJ09B0089-0700
Section 17 ROM
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