D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 955
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Figure A.1 shows timing waveforms for the address bus and the RD, HWR, and LWR signals
during execution of the above instruction with an 8-bit bus, using three-state access with no wait
states.
φ
Address bus
RD
HWR, LWR
Figure A.1 Address Bus, RD, HWR, and LWR Timing
of instruction
Fetching
3rd byte
(8-Bit Bus, Three-State Access, No Wait States)
R:W 2nd
of instruction
Fetching
4th byte
operation
Internal
High
Rev.7.00 Feb. 14, 2007 page 921 of 1108
jump address
instruction at
1st byte of
Fetching
R:W EA
Appendix A Instruction Set
jump address
instruction at
2nd byte of
Fetching
REJ09B0089-0700
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