D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 656
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Section 17 ROM
17.11.9 Programmer Mode Transition Time
Commands cannot be accepted during the oscillation stabilization period or the progremmer mode
setup period. After the progremmer mode setup time, a transition is made to memory read mode.
Table 17.24 Command Wait State Transition Time Specifications
Item
Standby release (oscillation
stabilization time)
Programmer mode setup time
V
Rev.7.00 Feb. 14, 2007 page 622 of 1108
REJ09B0089-0700
CC
Figure 17.29 Oscillation Stabilization Time, Programmer Mode Setup Time, and Power
hold time
V
RES
FWE
Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low.
CC
t
osc1
t
bmv
Symbol
t
t
t
osc1
bmv
dwn
Supply Fall Sequence
Memory read
mode
Command
wait state
Min
30
10
0
Auto-program mode
Auto-erase mode
Max
—
—
—
Command
wait state
Normal/
abnormal end
identification
t
dwn
Unit
ms
ms
ms
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