D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 890
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Section 20 Electrical Characteristics
(2) Control Signal Timing
Table 20.24 Control Signal Timing
Condition B: V
Item
RES setup time
RES pulse width
NMI setup time
NMI hold time
NMI pulse width (in recovery from
software standby mode)
IRQ setup time
IRQ hold time
IRQ pulse width (in recovery from
software standby mode)
Rev.7.00 Feb. 14, 2007 page 856 of 1108
REJ09B0089-0700
0 V, φ = 2 MHz to 25 MHz, T
T
a
CC
= –40°C to 85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
CC
RESS
RESW
NMIS
NMIH
NMIW
IRQS
IRQH
IRQW
= 3.0 V to 3.6 V, V
a
= –20°C to 75°C (regular specifications),
Min
200
20
150
10
200
150
10
200
ref
Max
—
—
—
—
—
—
—
—
= 3.0 V to AV
Unit
ns
t
ns
ns
ns
ns
ns
ns
cyc
CC
, V
Test Conditions
Figure 20.4
Figure 20.5
SS
= AV
SS
=
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