D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 860
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Section 20 Electrical Characteristics
Item
WR delay time 1
WR delay time 2
WR pulse width 1
WR pulse width 2
Write data delay time
Write data setup time
Write data hold time
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Rev.7.00 Feb. 14, 2007 page 826 of 1108
REJ09B0089-0700
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
WTS
WTH
BRQS
BACD
BZD
BRQOD
Min
—
—
1.0 ×
t
1.5 ×
t
—
0.5 ×
t
0.5 ×
t
30
5
30
—
—
—
cyc
cyc
cyc
cyc
– 20
– 20
– 20
– 10
Condition A
Max
20
20
—
—
30
—
—
—
—
—
15
50
30
Min
—
—
1.0 ×
t
1.5 ×
t
—
0.5 ×
t
0.5 ×
t
25
5
30
—
—
—
cyc
cyc
cyc
cyc
– 15
– 15
– 15
– 8
Condition B
Max
15
15
—
—
20
—
—
—
—
—
15
40
25
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figures 20.6 to 20.10
Figure 20.8
Figure 20.11
Figure 20.12
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