HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 1033

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Table 22.32 Control Signal Timing (2)
Item
BREQ setup
time
BREQ hold
time
BACK delay
time
Bus tri-state
delay time
Bus tri-state
delay time
to standby
mode
Bus buffer
on time
Bus buffer
on time from
standby
STATUS0/1
delay time
Notes: 1. V
2. V
3. V
DDQ
DDQ
DDQ
Symbol Min
t
t
t
t
t
t
t
t
t
t
BREQS
BREQH
BACKD
BOFF1
BOFF2
BON1
BON2
STD1
STD2
STD3
= 3.0 to 3.6 V, V
= 3.0 to 3.6 V, V
= 3.0 to 3.6 V, V
HD6417750
VF128 (V)
3.5
1.5
—
—
—
—
—
—
—
—
*
1
Max
—
—
10
15
2
12
2
6
2
2
DD
DD
DD
= 1.5 V, T
= 1.8 V, T
= 1.8 V, T
HD6417750
SVF133 (V)
HD6417750
SVBT133 (V)
Min
3.5
1.5
—
—
—
—
—
—
—
—
*
1
Max
—
—
10
15
2
12
2
6
2
2
a
a
a
= –20 to +75°C, C
= –20 to +75°C, C
= –20 to +75°C, C
HD6417750
F167 (V)
HD6417750
SF167 (V)
HD6417750
SF200 (V)
Min
3.5
1.5
—
—
—
—
—
—
—
—
*
Rev.7.00 Oct. 10, 2008 Page 947 of 1074
2
Max
—
—
8
12
2
12
2
6
2
2
Section 22 Electrical Characteristics
L
L
L
HD6417750
BP200M (V)
HD6417750
SBP200 (V)
Min
3
1.5
—
—
—
—
—
—
—
—
= 30 pF, PLL2 on
= 30 pF, PLL2 on
= 30 pF, PLL2 on
*
3
Max
—
—
6
10
2
12
2
6
2
2
Unit Figure
ns
ns
ns
ns
t
ns
t
ns
t
t
cyc
cyc
cyc
cyc
REJ09B0366-0700
22.13
22.13
22.13
22.13
22.14
(2)
22.13
22.14
(2)
22.14
(1)
22.14
(1), (2)
22.14
(2)
Notes