HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 1058

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 22 Electrical Characteristics
Rev.7.00 Oct. 10, 2008 Page 972 of 1074
REJ09B0366-0700
DACKn
(SA: IO → memory)
Legend:
IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
CKIO
BANK
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
D63–D0
(write)
BS
CKE
Figure 22.31 Synchronous DRAM Normal Write Bus Cycle: PRE + ACT + WRITE
Commands, Burst (RASD = 1, RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010)
t
WDD
t
t
t
t
Tpr
t
t
AD
CASD2
RWD
RASD
CSD
DACD
Row
H/L
Tpc
t
t
RWD
RASD
t
t
t
RASD
Tr
AD
DACD
Row
Row
Row
Trw
t
RASD
t
WDD
t
CASD2
t
Tc1
t
t
t
BSD
AD
RWD
DQMD
H/L
c0
d0
t
CASD2
Tc2
t
t
t
RWD
BSD
WDD
d1
Tc3
t
DACD
d2
Tc4
d3
Trwl
t
t
t
AD
CSD
DQMD
Trwl