ML610Q409-NNNTBZ03A7 Rohm Semiconductor, ML610Q409-NNNTBZ03A7 Datasheet - Page 91

• Manufacturer Part Number: ML610Q409-NNNTBZ03A7
• Description: MCU 8BIT 16K FLASH 4CH 100-TQFP
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of ML610Q409-NNNTBZ03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SSP, UART/USART
• Peripherals: LCD, Melody Driver, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.25 V ~ 3.6 V
• Data Converters: A/D 2x16b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 100-TFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

6.3 Description of Operation
6.3.1
6.3.1.1 Low-Speed Clock Generation Circuit
Figure 6-2 shows the circuit configuration of the low-speed clock generation circuit.
For the low-speed clock generation circuit, externally provide a 32.768kHz crystal oscillator and capacitors (C
C
In the STOP mode, the XT0 and XT1 pins become Hiz (high-impedance).
When the ENMLT bit of FCON1 is set to “1”, the low-speed double clock (LSCLK x 2) starts operation.
Note:
DL
Install a crystal as close to the LSI as possible and make sure that signals causing noise and power supply wiring are
not near the crystal and its wiring.
Note that oscillation may stop due to condensation.
).
Low-Speed Clock
V
crystal oscillator
SS
C
GL
32.768kHz
Figure 6-2 Circuit Configuration of 32.768 kHz Crystal Oscillation Mode
C
DL
XT0
XT1
R
V
F
DDL
Control circuit
6-5
ML610Q407/ML610Q408/ML610Q409 User's Manual
2× clock
circuit
Chapter 6 Clock Generation Circuit
STOP mode
Low-speed double clock
(LSCLK x 2)
ENMLT
Low-speed clock
(LSCLK)
GL
and