MT29C4G48MAZAPAKD-5 IT Micron Technology Inc, MT29C4G48MAZAPAKD-5 IT Datasheet - Page 11

• Manufacturer Part Number: MT29C4G48MAZAPAKD-5 IT
• Description: MICMT29C4G48MAZAPAKD-5_IT 4G+2G MCP
• Manufacturer: Micron Technology Inc

MCP General Description
PDF: 09005aef83ba4387
168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. H 3/11
Micron package-on-package (PoP) MCP products combine NAND Flash and Mobile
LPDRAM devices in a single MCP. These products target mobile applications with low-
power, high-performance, and minimal package-footprint design requirements. The
NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete mem-
ory products portfolio.
The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces
(no shared address, control, data, or power balls). This bus architecture supports an op-
timized interface to processors with separate NAND Flash and Mobile LPDRAM buses.
The NAND Flash and Mobile LPDRAM devices have separate core power connections
and share a common ground (that is, V
The bus architecture of this device also supports separate NAND Flash and Mobile
LPDRAM functionality without concern for device interaction.
168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
is tied together on the two devices).
MCP General Description
© 2009 Micron Technology, Inc. All rights reserved.