PIC24EP64MC204-E/PT Microchip Technology, PIC24EP64MC204-E/PT Datasheet - Page 28

• Manufacturer Part Number: PIC24EP64MC204-E/PT
• Description: 16 Bit MCU, 64KB Flash, 8KB RAM, 60 MHz, 44 Pin, MCPWM,QEI, 3 OpAmp, 4 Comp, PTG
• Manufacturer: Microchip Technology

dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 1 Ohms) capacitor is required on the
V
regulator output voltage. The V
connected to V
than 4.7 µF (10 µF is recommended), 16V connected
to ground. The type can be ceramic or tantalum. See
Section 30.0
additional information.
DS70657F-page 28
CAP
Ceramic
V
0.1 µF
Note 1:
DD
R
C
pin, which is used to stabilize the voltage
R1
CPU Logic Filter Capacitor
Connection (V
TANK CAPACITORS
As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
AV
impedance should be less than 1 and the inductor
capacity greater than 10 mA.
Where:
L
f
f
Tantalum
L1
MCLR
V
V
DD
=
=
=
10 µF
SS
DD
DD
(1)
“Electrical
to improve ADC noise rejection. The inductor


F
------------- -
-----------------------

, and must have a capacitor greater
2 LC
--------------------- -

CNV
2f C
2
dsPIC33E/PIC24E
1
1
RECOMMENDED
MINIMUM CONNECTION




Ceramic
0.1 µF
(i.e., ADC conversion rate/2)
2
CAP
Characteristics”
)
CAP
pin must not be
V
V
DD
SS
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
DD
and
for
The placement of this capacitor should be close to the
V
exceeds one-quarter inch (6 mm). See
“On-Chip Voltage Regulator”
2.4
The
functions:
• Device Reset
• Device Programming and Debugging.
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components as shown in
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
CAP
Note 1: R  10 k is recommended. A suggested
example,
pin. It is recommended that the trace length not
MCLR
2: R1  470 will limit any current flowing into
Master Clear (MCLR) Pin
V
starting value is 10 k. Ensure that the MCLR
pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
IH
DD
pin
R
JP
C
and V
(1)
IH
as
 2011-2012 Microchip Technology Inc.
and V
provides
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
specifications are met.
R1
IL
(2)
IH
specifications are met.
and V
dsPIC33EP/PIC24EP
MCLR
in
for details.
two
IL
Figure
) and fast signal
Figure 2-2
specific
Section 27.3
2-2,
device
within
it
is