AD9628 Analog Devices, AD9628 Datasheet - Page 12

• Manufacturer Part Number: AD9628
• Description: 12-Bit, 125/105 MSPS, 1.8 V Dual Analog-to-Digital Converter
• Manufacturer: Analog Devices

Specifications of AD9628

• Resolution (bits): 12bit
• # Chan: 2
• Sample Rate: 125MSPS
• Interface: LVDS,Par
• Analog Input Type: Diff-Bip,SE-Uni
• Ain Range: 2 V p-p
• Adc Architecture: Pipelined
• Pkg Type: CSP

AD9628
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The inputs and outputs are rated to the supply voltage (AVDD or DRVDD) +
0.2 V but should not exceed 2.1 V.
AVDD to AGND
DRVDD to AGND
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/DCS to AGND
OEB
PDWN
D0A/D0B through D11A/D11B to
DCOA/DCOB to AGND
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
AGND
(Ambient)
Under Bias
(Ambient)
1
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. 0 | Page 12 of 44
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Package Type
64-Lead LFCSP
9 mm × 9 mm
(CP-64-4)
1
2
3
4
Typical θ
plane. As shown Table 7, airflow improves heat dissipation,
which reduces θ
package leads from metal traces, through holes, ground, and
power planes reduces θ
ESD CAUTION
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
JA
is specified for a 4-layer PCB with a solid ground
Airflow
Velocity
(m/sec)
0
1.0
2.5
JA
. In addition, metal in direct contact with the
JA
.
θ
22.3
19.5
17.5
JA
1, 2
θ
1.4
N/A
N/A
JC
1, 3
θ
N/A
11.8
N/A
JB
1, 4
Ψ
0.1
0.2
0.2
JT
1, 2
Unit
°C/W
°C/W
°C/W