XC2VP70 Xilinx, Inc., XC2VP70 Datasheet - Page 117

• Manufacturer Part Number: XC2VP70
• Description: Virtex-ii Pro Field Programmable Gate Array
• Manufacturer: Xilinx, Inc.

FG256 Fine-Pitch BGA Package
FG256 Fine-Pitch BGA Package
As shown in
pins in each of these devices are identical. Following this table are the
(1.00mm
Table 5: FG256 — XC2VP2 and XC2VP4
6
pitch).
Bank
Table
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
5, XC2VP2 and XC2VP4 Virtex-II Pro devices are available in the FG256 fine-pitch BGA package. The
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L03P_0/VREF_0
IO_L09P_0/VREF_0
IO_L69P_0/VREF_0
IO_L69N_1/VREF_1
IO_L09N_1/VREF_1
IO_L03N_1/VREF_1
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
Pin Description
IO_L02N_0
IO_L02P_0
IO_L03N_0
IO_L06N_0
IO_L06P_0
IO_L07P_0
IO_L09N_0
IO_L69N_0
IO_L69P_1
IO_L09P_1
IO_L07N_1
IO_L06N_1
IO_L06P_1
IO_L03P_1
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FG256 Fine-Pitch BGA Package Specifications
DS083-4 (v2.5.5) August 25, 2003
Advance Product Specification
Pin Number
D11
C12
C10
D10
E10
E11
D12
A14
A15
C2
C3
B3
C4
A2
A3
D5
C5
D6
E6
E7
D7
C7
D8
C8
B8
A8
A9
B9
C9
D9
R